Spectral module and method for manufacturing spectral module

ABSTRACT

A spectroscopic module includes a support body having a bottom wall portion and a side wall portion surrounding a space on one side of the bottom wall portion, a spectroscopic portion provided on the one side of the bottom wall portion and having a plurality of grating grooves, a photodetector attached to the side wall portion so as to face the spectroscopic portion via the space and having a plurality of photodetection channels, a plurality of first terminals provided on a surface of the support body on a side opposite to the space so as to be disposed along the surface of the support body and electrically connected to the photodetector, and a wiring unit having a plurality of second terminals respectively facing the plurality of first terminals and respectively joined to the plurality of first terminals and a plurality of third terminals respectively and electrically connected to the plurality of second terminals.

TECHNICAL FIELD

The present disclosure relates to a spectroscopic module and a methodfor manufacturing a spectroscopic module.

BACKGROUND ART

Known is a spectroscopic module including a spectroscopic module havinga light transmitting member and a spectroscopic portion and aphotodetector provided on the light transmitting member so as to faceeach other via the light transmitting member, a package accommodatingthe spectroscopic module, and a lead provided in the package andelectrically connected to the photodetector (see, for example, PatentLiterature 1).

CITATION LIST Patent Literature

Patent Literature 1: Japanese Unexamined Patent Publication No.2009-210416

SUMMARY OF INVENTION Technical Problem

The spectroscopic module as described above may be mounted and used on arigid wiring substrate. In that case, the package may be distorted dueto the stress or the like that is generated during the mounting or thepackage may be distorted due to the thermal strain or the like that isgenerated on the rigid wiring substrate after the mounting. However, inthe spectroscopic module as described above, the spectroscopic portionand the photodetector are provided on the light transmitting member soas to face each other via the light transmitting member, and thus therelationship between the position (coordinates) of each of a pluralityof photodetection channels of the photodetector and the peak wavelengthof light incident on each of the plurality of photodetection channels(hereinafter, sometimes simply referred to as “relationship between thephotodetection channel and the peak wavelength”) is unlikely to deviateeven if the package is distorted.

In contrast, in a spectroscopic module configured such that thespectroscopic portion and the photodetector face each other via a space,particularly in a spectroscopic module configured such that a supportbody defining a space supports the spectroscopic portion and thephotodetector, the positional relationship between the spectroscopicportion and the photodetector is likely to deviate and thus therelationship between the photodetection channel and the peak wavelengthis also likely to deviate when the support body is distorted during orafter mounting with respect to a rigid wiring substrate.

In this regard, an object of the present disclosure is to provide aspectroscopic module and a method for manufacturing the spectroscopicmodule with which a decline in detection accuracy can be reliablysuppressed in a configuration in which a spectroscopic portion and aphotodetector face each other via a space.

Solution to Problem

A spectroscopic module of one aspect of the present disclosure includesa support body having a bottom wall portion and a side wall portionsurrounding a space on one side of the bottom wall portion, aspectroscopic portion provided on the one side of the bottom wallportion and having a plurality of grating grooves, a photodetectorattached to the side wall portion so as to face the spectroscopicportion via the space and having a plurality of photodetection channels,a plurality of first terminals provided on a surface of the support bodyon a side opposite to the space so as to be disposed along the surfaceof the support body and electrically connected to the photodetector, anda wiring unit having a plurality of second terminals respectively facingthe plurality of first terminals and respectively joined to theplurality of first terminals and a plurality of third terminalsrespectively and electrically connected to the plurality of secondterminals.

In the spectroscopic module of one aspect of the present disclosure, theplurality of first terminals electrically connected to the photodetectorare provided on the surface of the support body and the plurality ofsecond terminals of the wiring unit respectively face the plurality offirst terminals and are respectively joined to the plurality of firstterminals. In a configuration in which a plurality of terminals of arigid wiring substrate are respectively joined to the plurality of firstterminals, for example, the support body is distorted due to the stressor the like that is generated during the joining or the support body isdistorted due to the thermal strain or the like that is generated on therigid wiring substrate after the joining, and thus the positionalrelationship between the spectroscopic portion and the photodetector maydeviate and the relationship between the photodetection channel and thepeak wavelength may deviate. In contrast, in the spectroscopic module ofone aspect of the present disclosure, the electrical connection betweenthe photodetector and the rigid wiring substrate can be realized via thewiring unit, and thus it is possible to suppress the deviation in therelationship between the photodetection channel and the peak wavelength.Accordingly, with the spectroscopic module of one aspect of the presentdisclosure, it is possible to reliably suppress a decline in detectionaccuracy in the configuration in which the spectroscopic portion and thephotodetector face each other via the space.

In the spectroscopic module of one aspect of the present disclosure, theplurality of first terminals may be provided on a flat region having alargest area among a plurality of flat regions, the plurality of flatregions constituting the surface of the support body. As a result, it ispossible to improve the degree of freedom in terms of the shape of eachfirst terminal, the disposition of the plurality of first terminals, andso on and it is possible to realize a reliable joining between the firstterminal and the second terminal facing each other.

In the spectroscopic module of one aspect of the present disclosure, theplurality of first terminals may be provided on a surface of the sidewall portion on the side opposite to the space as the surface of thesupport body. By the surface of the side wall portion on the sideopposite to the space being wide, it is possible to improve the degreeof freedom in terms of the shape of each first terminal, the dispositionof the plurality of first terminals, and so on and it is possible torealize a reliable joining between the first terminal and the secondterminal facing each other.

In the spectroscopic module of one aspect of the present disclosure, thespectroscopic portion and the photodetector face each other in a firstdirection, the plurality of grating grooves are arranged in a seconddirection perpendicular to the first direction, and the plurality offirst terminals may be provided on a region of the surface of the sidewall portion, the region extending in the second direction as alongitudinal direction. By the region that extends in the seconddirection as a longitudinal direction being wide, it is possible toimprove the degree of freedom in terms of the shape of each firstterminal, the disposition of the plurality of first terminals, and so onand it is possible to realize a reliable joining between the firstterminal and the second terminal facing each other.

In the spectroscopic module of one aspect of the present disclosure, afirst terminal and a second terminal facing each other in the pluralityof first terminals and the plurality of second terminals may be joinedto each other via a joining member. As a result, it is possible torealize a reliable joining between the first terminal and the secondterminal facing each other.

In the spectroscopic module of one aspect of the present disclosure, thejoining member may be a solder layer. As a result, it is possible toeasily realize a reliable joining between the first terminal and thesecond terminal facing each other.

In the spectroscopic module of one aspect of the present disclosure, thejoining member may hold a gap formed between the support body and thewiring unit. As a result, even if the wiring unit is deformed, theimpact of the deformation is mitigated in the gap between the supportbody and the wiring unit, and thus it is possible to suppress adeviation in the relationship between the photodetection channel and thepeak wavelength attributable to the deformation of the support body.

In the spectroscopic module of one aspect of the present disclosure,each of the plurality of first terminals may be a circular electrodepad. As a result, even if the wiring unit is deformed, the stressconcentration that is attributable to the deformation is mitigated ateach first terminal, and thus it is possible to suppress a deviation inthe relationship between the photodetection channel and the peakwavelength attributable to the deformation of the support body.

In the spectroscopic module of one aspect of the present disclosure,each of the plurality of second terminals may be a circular electrodepad. As a result, even if the wiring unit is deformed, the stressconcentration that is attributable to the deformation is mitigated ateach second terminal, and thus it is possible to suppress a deviation inthe relationship between the photodetection channel and the peakwavelength attributable to the deformation of the support body.

In the spectroscopic module of one aspect of the present disclosure, theplurality of third terminals may be configured as a connector. As aresult, the support body is not thermally affected when, for example,the wiring unit is connected to a rigid wiring substrate, and thus it ispossible to suppress a deviation in the relationship between thephotodetection channel and the peak wavelength.

In the spectroscopic module of one aspect of the present disclosure, thewiring unit may be configured by a flexible wiring substrate. As aresult, even if the wiring unit is deformed, the stress concentrationthat is attributable to the deformation is unlikely to occur in thesupport body, and thus it is possible to suppress a deviation in therelationship between the photodetection channel and the peak wavelengthattributable to the deformation of the support body. In addition, thedifference in thermal expansion coefficient between the wiring unit andthe support body is absorbed by the flexibility of the wiring unit, andthus it is possible to suppress a deviation in the relationship betweenthe photodetection channel and the peak wavelength even if thetemperature of the environment of use changes.

In the spectroscopic module of one aspect of the present disclosure, thewiring unit may further have a plurality of wirings respectivelyconnecting the plurality of second terminals and the plurality of thirdterminals, and a support substrate, and a bending strength of thesupport substrate may be smaller than a bending strength of the supportbody. As a result, even if the wiring unit is deformed, the stressconcentration that is attributable to the deformation is unlikely tooccur in the support body, and thus it is possible to suppress adeviation in the relationship between the photodetection channel and thepeak wavelength attributable to the deformation of the support body.

The spectroscopic module of one aspect of the present disclosure mayfurther include a rigid wiring substrate to which the plurality of thirdterminals are connected. As a result, it is possible to realize anelectrical connection between the photodetector and the rigid wiringsubstrate while reliably suppressing a decline in detection accuracy ina configuration in which the spectroscopic portion and the photodetectorface each other via the space.

A method for manufacturing spectroscopic module of one aspect of thepresent disclosure includes a first step of preparing a spectroscopeincluding a support body having a bottom wall portion and a side wallportion surrounding a space on one side of the bottom wall portion, aspectroscopic portion provided on the one side of the bottom wallportion and having a plurality of grating grooves, a photodetectorattached to the side wall portion so as to face the spectroscopicportion via the space and having a plurality of photodetection channels,and a plurality of first terminals provided on a surface of the supportbody so as to be disposed along the surface of the support body andelectrically connected to the photodetector, a second step of preparinga wiring unit having a plurality of second terminals and a plurality ofthird terminals respectively and electrically connected to the pluralityof second terminals, a third step of causing the plurality of firstterminals and the plurality of second terminals to face each other andjoining a first terminal and a second terminal to each other after thefirst step and the second step, the first terminal and the secondterminal facing each other in the plurality of first terminals and theplurality of second terminals, and a fourth step of acquiring arelationship between a position of each of the plurality ofphotodetection channels and a peak wavelength of light incident on eachof the plurality of photodetection channels after the third step.

If the first terminal and the second terminal facing each other arejoined to each other after, for example, the acquisition of therelationship between the photodetection channel and the peak wavelength,the support body is distorted due to the stress or the like that isgenerated during the joining and the acquired relationship may deviate.In contrast, in the spectroscopic module manufacturing method of oneaspect of the present disclosure, the relationship between thephotodetection channel and the peak wavelength is acquired after thefirst terminal and the second terminal facing each other are joined toeach other. Therefore, according to the spectroscopic modulemanufacturing method of one aspect of the present disclosure, it ispossible to reliably suppress a decline in detection accuracy in themanufactured spectroscopic module by performing spectroscopic analysisbased on the acquired relationship.

A method for manufacturing spectroscopic module of one aspect of thepresent disclosure includes a first step of preparing a spectroscopeincluding a support body having a bottom wall portion and a side wallportion surrounding a space on one side of the bottom wall portion, aspectroscopic portion provided on the one side of the bottom wallportion and having a plurality of grating grooves, a photodetectorattached to the side wall portion so as to face the spectroscopicportion via the space and having a plurality of photodetection channels,and a plurality of first terminals provided on a surface of the supportbody so as to be disposed along the surface of the support body andelectrically connected to the photodetector, a second step of preparinga wiring unit having a plurality of second terminals and a plurality ofthird terminals respectively and electrically connected to the pluralityof second terminals and providing a joining member for each of theplurality of second terminals by heat treatment, and a third step ofcausing the plurality of first terminals and the plurality of secondterminals to face each other and joining a first terminal and a secondterminal to each other via the joining member by heat treatment afterthe first step and the second step, the first terminal and the secondterminal facing each other in the plurality of first terminals and theplurality of second terminals.

If the joining member is provided for each of the plurality of firstterminals by heat treatment and the first terminal and the secondterminal facing each other are joined to each other via the joiningmember by heat treatment, for example, the support body is thermallyaffected twice, and thus the deviation that occurs in the relationshipbetween the photodetection channel and the peak wavelength may increase.In contrast, in the spectroscopic module manufacturing method of oneaspect of the present disclosure, the joining member is provided foreach of the plurality of second terminals by heat treatment and thefirst terminal and the second terminal facing each other are joined toeach other via the joining member by heat treatment, and thus thesupport body is thermally affected only once. Therefore, according tothe spectroscopic module manufacturing method of one aspect of thepresent disclosure, it is possible to suppress a deviation in therelationship between the photodetection channel and the peak wavelengthand reliably suppress a decline in detection accuracy in themanufactured spectroscopic module.

In the method for manufacturing spectroscopic module of one aspect ofthe present disclosure, a plurality of the wiring units connected toeach other may be prepared in the second step and the plurality ofwiring units to which the spectroscope is attached may be separated fromeach other after the third step. As a result, a plurality of thespectroscopic modules can be efficiently manufactured.

Advantageous Effects of Invention

According to the present disclosure, it is possible to provide aspectroscopic module and a method for manufacturing the spectroscopicmodule with which a decline in detection accuracy can be reliablysuppressed in a configuration in which a spectroscopic portion and aphotodetector face each other via a space.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective view of a spectroscopic module of oneembodiment.

FIG. 2 is a perspective view of a spectroscope illustrated in FIG. 1.

FIG. 3 is a cross-sectional view of the spectroscope taken along lineIII-III illustrated in FIG. 2.

FIG. 4 is a cross-sectional view of the spectroscope taken along lineIV-IV illustrated in FIG. 2.

FIG. 5 is a cross-sectional view of the spectroscope taken along lineV-V illustrated in FIG. 2.

FIG. 6 is a plan view of a wiring unit illustrated in FIG. 1.

FIG. 7 is a cross-sectional view of a part of the spectroscopic moduletaken along line VII-VII illustrated in FIG. 1.

FIG. 8 is a diagram illustrating one step of a method for manufacturingthe spectroscopic module illustrated in FIG. 1.

FIG. 9 is a diagram illustrating one step of the method formanufacturing the spectroscopic module illustrated in FIG. 1.

FIG. 10 is a diagram illustrating one step of the method formanufacturing the spectroscopic module illustrated in FIG. 1.

FIG. 11 is a diagram illustrating one step of the method formanufacturing the spectroscopic module illustrated in FIG. 1.

FIG. 12 is a perspective view of a spectroscopic module of amodification example.

FIG. 13 is a cross-sectional view of a part of the spectroscopic moduleof the modification example.

FIG. 14 is a cross-sectional view of a spectroscope of the modificationexample.

FIG. 15 is a perspective view of the spectroscopic module of themodification example.

DESCRIPTION OF EMBODIMENTS

Hereinafter, an embodiment of the present disclosure will be describedin detail with reference to the drawings. It should be noted that thesame or corresponding parts in the drawings are denoted by the samereference numerals without redundant description.

Configuration of Spectroscopic Module

As illustrated in FIG. 1, a spectroscopic module 100 includes aspectroscope 1 and a wiring unit 200. As illustrated in FIGS. 1 and 2,in the spectroscope 1, a box-shaped package 2 is configured by a supportbody 10 and a cover 20. The support body 10 is configured as a moldedinterconnect device (MID) and provided with a plurality of wirings 11.As an example, the spectroscope 1 has a rectangular parallelepiped shapein which the length in each of the X-axis direction, the Y-axisdirection (direction perpendicular to the X-axis direction), and theZ-axis direction (direction perpendicular to the X-axis direction andthe Y-axis direction) is 15 mm or less. In particular, the spectroscope1 is thin to the extent that the length in the Y-axis direction isapproximately several millimeters.

As illustrated in FIGS. 3 and 4, a photodetector 30, a resin layer 40,and a reflective layer 50 are provided in the package 2. The reflectivelayer 50 is provided with a first reflection portion 51 and aspectroscopic portion 52. The photodetector 30 is provided with a lightpassage portion 31, a second reflection portion 32, a light detectingportion 33, and a 0th-order light capturing portion 34. The lightpassage portion 31, the first reflection portion 51, the secondreflection portion 32, the spectroscopic portion 52, the light detectingportion 33, and the 0th-order light capturing portion 34 are arranged onthe same straight line parallel to the X-axis direction when viewed fromthe optical axis direction of light L1 passing through the light passageportion 31 (that is, the Z-axis direction).

In the spectroscope 1, the light L1 that has passed through the lightpassage portion 31 is reflected by the first reflection portion 51 andthe light L1 reflected by the first reflection portion 51 is reflectedby the second reflection portion 32. The light L1 reflected by thesecond reflection portion 32 is dispersed and reflected by thespectroscopic portion 52. Of the light dispersed and reflected by thespectroscopic portion 52, light L2, which heads toward the lightdetecting portion 33 and is other than 0th-order light L0, is incidenton the light detecting portion 33 and detected by the light detectingportion 33 and the 0th-order light L0 is incident on the 0th-order lightcapturing portion 34 and captured by the 0th-order light capturingportion 34. The optical path of the light L1 from the light passageportion 31 to the spectroscopic portion 52, the optical path of thelight L2 from the spectroscopic portion 52 to the light detectingportion 33, and the optical path of the 0th-order light L0 from thespectroscopic portion 52 to the 0th-order light capturing portion 34 areformed in a space S in the package 2.

The support body 10 has a bottom wall portion 12 and a side wall portion13. A depressed portion 14 and peripheral portions 15 and 16 areprovided on the surface of the bottom wall portion 12 that is on thespace S side. The side wall portion 13 is disposed on the side where thedepressed portion 14 opens with respect to the bottom wall portion 12.The side wall portion 13 surrounds the space S on one side of the bottomwall portion 12. In the present embodiment, the side wall portion 13 hasa rectangular frame shape that surrounds the depressed portion 14 andthe peripheral portions 15 and 16 when viewed from the Z-axis direction.More specifically, the side wall portion 13 has a pair of first sidewalls 17 and a pair of second side walls 18. When viewed from the Z-axisdirection, the pair of first side walls 17 face each other across thedepressed portion 14 and the peripheral portions 15 and 16 in the X-axisdirection. When viewed from the Z-axis direction, the pair of secondside walls 18 face each other across the depressed portion 14 and theperipheral portions 15 and 16 in the Y-axis direction. The bottom wallportion 12 and the side wall portion 13 are integrally formed of resin.

The side wall portion 13 is provided with a first widened portion 13 aand a second widened portion 13 b. The first widened portion 13 a is astepped portion where the space S is widened only in the X-axisdirection on the side opposite to the bottom wall portion 12. The secondwidened portion 13 b is a stepped portion where the first widenedportion 13 a is widened in each of the X-axis direction and the Y-axisdirection on the side opposite to the bottom wall portion 12. One endportion of each wiring 11 is disposed as a terminal 11 a in the firstwidened portion 13 a. Each wiring 11 reaches an outside surface 18 b ofone of the second side walls 18 from the first widened portion 13 a viathe second widened portion 13 b and the outside surface of the firstside wall 17 (see FIG. 2). The outside surface 18 b is a part of thesurface of the side wall portion 13 on the side opposite to the space Sthat is the surface of the support body 10 on the side opposite to thespace S and is a region of the surface of the side wall portion 13 onthe side opposite to the space S that extends in the X-axis direction asa longitudinal direction. On the outside surface 18 b, the other endportion of each wiring 11 is disposed as a terminal (first terminal) 11b.

The wiring 11 and the plurality of terminals 11 b are provided on thesurface of the support body 10 so as to be disposed along the surface ofthe support body 10 (outside surface 18 b in the present embodiment).Each terminal 11 b is a circular electrode pad. The plurality ofterminals 11 b are electrically connected to the photodetector 30 asdescribed later. It should be noted that the outside surface 18 bprovided with the plurality of terminals 11 b is the flat region thathas the largest area among the plurality of flat regions constitutingthe surface of the support body 10 on the side opposite to the space S.

As illustrated in FIGS. 3, 4, and 5, the length of the depressed portion14 in the X-axis direction is larger than the length of the depressedportion 14 in the Y-axis direction when viewed from the Z-axisdirection. The depressed portion 14 includes an inner surface 14 ahaving a concave curved surface shape. The inner surface 14 a has, forexample, a shape in which both sides of a part of a spherical surface(spherical cap) are cut off in a plane parallel to the ZX plane. In thismanner, the inner surface 14 a is curved in a curved surface shape ineach of the X-axis direction and the Y-axis direction. In other words,the inner surface 14 a is curved in a curved surface shape both whenviewed from the Y-axis direction (see FIG. 3) and when viewed from theX-axis direction (see FIG. 4).

The peripheral portions 15 and 16 are adjacent to the depressed portion14 in the X-axis direction. The peripheral portion 15 is positioned onthe side of one of the first side walls 17 (one side in the X-axisdirection) with respect to the depressed portion 14 when viewed from theZ-axis direction. The peripheral portion 16 is positioned on the side ofthe other first side wall 17 (the other side in the X-axis direction)with respect to the depressed portion 14 when viewed from the Z-axisdirection. When viewed from the Z-axis direction, the area of theperipheral portion 15 is larger than the area of the peripheral portion16. In the spectroscope 1, the area of the peripheral portion 16 isnarrowed to the extent that the outer edge of the inner surface 14 a ofthe depressed portion 14 is in contact with an inside surface 17 a ofthe other first side wall 17 when viewed from the Z-axis direction. Theperipheral portion 15 includes an inclined surface 15 a. The inclinedsurface 15 a is inclined so as to be separated from the photodetector 30along the Z-axis direction as the distance between the inclined surface15 a and the depressed portion 14 increases along the X-axis direction.

The shapes of the depressed portion 14 and the peripheral portions 15and 16 are configured by the shape of the support body 10. In otherwords, the depressed portion 14 and the peripheral portions 15 and 16are defined only by the support body 10. The inner surface 14 a of thedepressed portion 14 and the inside surface 17 a of the one first sidewall 17 are connected to each other via the peripheral portion 15 (thatis, physically separated from each other). The inner surface 14 a of thedepressed portion 14 and the inside surface 17 a of the other first sidewall 17 are connected to each other via the peripheral portion 16 (thatis, physically separated from each other). The inner surface 14 a of thedepressed portion 14 and an inside surface 18 a of each second side wall18 are connected to each other via an inter-surface intersection line(corner, bending point, or the like). In this manner, the inner surface14 a of the depressed portion 14 and the inside surfaces 17 a and 18 aof the side wall portion 13 are connected to each other in adiscontinuous state (state of physical separation, state ofinterconnection via an inter-surface intersection line, or the like).When viewed from the Z-axis direction, a boundary line 19 between thedepressed portion 14 and the peripheral portion 15 adjacent to eachother in the X-axis direction crosses the bottom wall portion 12 alongthe Y-axis direction (see FIG. 5). In other words, both ends of theboundary line 19 reach the inside surface 18 a of each second side wall18.

As illustrated in FIGS. 3 and 4, the photodetector 30 has a substrate35. The substrate 35 is formed in a rectangular plate shape and of asemiconductor material such as silicon. The light passage portion 31 isa slit provided in the substrate 35 and extends in the Y-axis direction.The 0th-order light capturing portion 34 is a slit provided in thesubstrate 35, is positioned between the light passage portion 31 and thelight detecting portion 33 when viewed from the Z-axis direction, andextends in the Y-axis direction. It should be noted that the end portionof the light passage portion 31 on the incident side of the light L1spreads out toward the incident side of the light L1 in each of theX-axis direction and the Y-axis direction. In addition, the end portionof the 0th-order light capturing portion 34 on the side opposite to theincident side of the 0th-order light L0 spreads out toward the sideopposite to the incident side of the 0th-order light L0 in each of theX-axis direction and the Y-axis direction. With the configuration inwhich the 0th-order light L0 is obliquely incident on the 0th-orderlight capturing portion 34, it is possible to more reliably suppress the0th-order light L0 incident on the 0th-order light capturing portion 34returning to the space S.

The second reflection portion 32 is provided on the region of a surface35 a of the substrate 35 on the space S side that is between the lightpassage portion 31 and the 0th-order light capturing portion 34. Thesecond reflection portion 32 is a metal film such as Al and Au andfunctions as a plane mirror.

The light detecting portion 33 is provided on the surface 35 a of thesubstrate 35. More specifically, the light detecting portion 33 is notattached to the substrate 35 but built into the substrate 35 made of thesemiconductor material. In other words, the light detecting portion 33is configured by a plurality of photodiodes formed by a first conductiveregion in the substrate 35 made of the semiconductor material and asecond conductive region provided in the region. The light detectingportion 33 is configured as, for example, a photodiode array, a C-MOSimage sensor, or a CCD image sensor and has a plurality ofphotodetection channels 33 a arranged in the X-axis direction. The lightL2 having a different wavelength is incident on each photodetectionchannel 33 a of the light detecting portion 33. A plurality of terminals36 for inputting and outputting electric signals with respect to thelight detecting portion 33 are provided on the surface 35 a of thesubstrate 35. It should be noted that the light detecting portion 33 maybe configured as a surface-incident photodiode or may be configured as abackside-incident photodiode. When the light detecting portion 33 isconfigured as a backside-incident photodiode, the plurality of terminals36 are provided on the surface of the substrate 35 on the side oppositeto the surface 35 a. Accordingly, in that case, each terminal 36 iselectrically connected to the terminal 11 a of the corresponding wiring11 by wire bonding.

The photodetector 30 is disposed in the first widened portion 13 a ofthe side wall portion 13. The terminal 36 of the photodetector 30 andthe terminal 11 a of the wiring 11 facing each other in the firstwidened portion 13 a are connected to each other by a solder layer 3. Asan example, the terminal 36 of the photodetector 30 and the terminal 11a of the wiring 11 facing each other are connected to each other by thesolder layer 3 formed on the surface of the terminal 36 via a platinglayer of a base (Ni—Au, Ni—Pd—Au, or the like). In this case, in thespectroscope 1, the photodetector 30 and the side wall portion 13 arefixed to each other by the solder layer 3 and the light detectingportion 33 of the photodetector 30 and the plurality of wirings 11 areelectrically connected to each other. A reinforcing member 7 made ofresin or the like is disposed between the photodetector 30 and the firstwidened portion 13 a so as to cover the connection portion between theterminal 36 of the photodetector 30 and the terminal 11 a of the wiring11 facing each other. In this manner, the photodetector 30 is attachedto the side wall portion 13 surrounding the space S when viewed from theZ-axis direction. In other words, the photodetector 30 is attached tothe side wall portion 13 so as to face the depressed portion 14 (thatis, so as to face the spectroscopic portion 52) via the space S. Itshould be noted that the Z-axis direction is a first direction in whichthe spectroscopic portion 52 and the photodetector 30 face each other inthe spectroscope 1.

The resin layer 40 is disposed on the inner surface 14 a of thedepressed portion 14. The resin layer 40 is formed by a resin materialthat is a molding material being cured (photocuring by UV light or thelike, thermosetting, or the like) with a molding die pressed against theresin material (photocurable epoxy resin, acrylic resin, fluororesin,silicone, optical resin for replica such as organic-inorganic hybridresin, or the like).

A grating pattern 41 is provided on the region of the resin layer 40that is offset to the peripheral portion 15 side (one side in the X-axisdirection) with respect to the center of the depressed portion 14 whenviewed from the Z-axis direction. The grating pattern 41 corresponds to,for example, a blazed grating having a serrated cross section, a binarygrating having a rectangular cross section, or a holographic gratinghaving a sinusoidal cross section.

The resin layer 40 is separated from the inside surface 17 a of the onefirst side wall 17 (first side wall 17 on the left side in FIG. 3) andis in contact with the inside surface 17 a of the other first side wall17 (first side wall 17 on the right side in FIG. 3), the inside surface18 a of the one second side wall 18, and the inside surface 18 a of theother second side wall 18. The resin layer 40 extends along the insidesurface 17 a of the other first side wall 17, the inside surface 18 a ofthe one second side wall 18, and the inside surface 18 a of the othersecond side wall 18 so as to crawl up the inside surfaces 17 a and 18 afrom the inner surface 14 a.

The thickness of the resin layer 40 in the Z-axis direction is larger ata part 43 in contact with the inside surface 17 a and a part 44 incontact with the inside surface 18 a than at a part 42 disposed on theinner surface 14 a. In other words, “Z-axis-direction thickness H2” ofthe part 43 of the resin layer 40 in contact with the inside surface 17a and “Z-axis-direction thickness H3” of the part 44 of the resin layer40 in contact with the inside surface 18 a are larger than“Z-axis-direction thickness H1” of the part 42 of the resin layer 40disposed on the inner surface 14 a. As an example, H1 is approximatelyseveral micrometers to 80 μm (the minimum value being at least athickness at which the surface roughness of the support body 10 can befilled) and H2 and H3 are approximately several hundred micrometerseach.

The resin layer 40 reaches the top of the inclined surface 15 a of theperipheral portion 15. The thickness of the resin layer 40 in the Z-axisdirection is larger at a part 45 reaching the peripheral portion 15 thanat the part 42 disposed on the inner surface 14 a. In other words,“Z-axis-direction thickness H4” of the part 45 of the resin layer 40reaching the peripheral portion 15 is larger than “Z-axis-directionthickness H1” of the part 42 of the resin layer 40 disposed on the innersurface 14 a. As an example, H4 is approximately several hundredmicrometers.

Here, when “Z-axis-direction thickness” changes at each of the parts 42,43, 44, and 45, the average value of the thicknesses of the parts 42,43, 44, and 45 can be regarded as “Z-axis-direction thickness” of eachof the parts 42, 43, 44, and 45. It should be noted that “thicknessalong the direction perpendicular to the inside surface 17 a” of thepart 43 in contact with the inside surface 17 a, “thickness along thedirection perpendicular to the inside surface 18 a” of the part 44 incontact with the inside surface 18 a, and “thickness along the directionperpendicular to the inclined surface 15 a” of the part 45 reaching theperipheral portion 15 are also larger than “thickness H1 along thedirection perpendicular to the inner surface 14 a” of the part 42disposed on the inner surface 14 a. The resin layer 40 as describedabove is formed in a continuous state.

The reflective layer 50 is disposed on the resin layer 40. Thereflective layer 50 is a metal film such as Al and Au. The region of thereflective layer 50 that faces the light passage portion 31 of thephotodetector 30 in the Z-axis direction is the first reflection portion51 functioning as a concave mirror. The first reflection portion 51 isdisposed on the inner surface 14 a of the depressed portion 14 and isoffset to the peripheral portion 16 side (the other side in the X-axisdirection) with respect to the center of the depressed portion 14 whenviewed from the Z-axis direction. The region of the reflective layer 50that covers the grating pattern 41 of the resin layer 40 is thespectroscopic portion 52 functioning as a reflective grating. Thespectroscopic portion 52 is disposed on the inner surface 14 a of thedepressed portion 14 and is offset to the peripheral portion 15 side(one side in the X-axis direction) with respect to the center of thedepressed portion 14 when viewed from the Z-axis direction. In thismanner, the first reflection portion 51 and the spectroscopic portion 52are provided on the resin layer 40 on the inner surface 14 a of thedepressed portion 14. In other words, the spectroscopic portion 52 isprovided on one side of the bottom wall portion 12 so as to face thephotodetector 30 via the space S.

A plurality of grating grooves 52 a of the spectroscopic portion 52 havea shape that follows the shape of the grating pattern 41. The pluralityof grating grooves 52 a are arranged in the X-axis direction when viewedfrom the Z-axis direction and are curved in a curve shape on the sameside (for example, in a convex arc shape on the peripheral portion 15side) when viewed from the Z-axis direction (see FIG. 5). It should benoted that the X-axis direction is a second direction that isperpendicular to the first direction and in which the plurality ofgrating grooves 52 a are arranged and the Y-axis direction is a thirddirection perpendicular to the first direction and the second directionin the spectroscope 1.

The reflective layer 50 covers the entire part 42 (including the gratingpattern 41) of the resin layer 40 disposed on the inner surface 14 a ofthe depressed portion 14, the entire part 43 of the resin layer 40 incontact with the inside surface 17 a of the other first side wall 17,the entire part 44 of the resin layer 40 in contact with the insidesurface 18 a of each second side wall 18, and a part of the part 45reaching the peripheral portion 15. In other words, the reflective layer50 constituting the first reflection portion 51 and the spectroscopicportion 52 is disposed on the resin layer 40 in a continuous state.

The cover 20 has a light transmitting member 21 and a light shieldingfilm 22. The light transmitting member 21 has a rectangular plate shapeand is made of a material that transmits the light L1 such as quartz,borosilicate glass (BK7), Pyrex (registered trademark) glass, and Kovarglass. The light shielding film 22 is provided on a surface 21 a on thespace S side of the light transmitting member 21. The light shieldingfilm 22 is provided with a light passage opening 22 a so as to face thelight passage portion 31 of the photodetector 30 in the Z-axisdirection. The light passage opening 22 a is a slit provided in thelight shielding film 22 and extends in the Y-axis direction.

It should be noted that silicon, germanium, or the like is alsoeffective as the material of the light transmitting member 21 wheninfrared rays are detected. In addition, anti-reflection (AR) coatingmay be performed on the light transmitting member 21 or the lighttransmitting member 21 may be provided with a filter function totransmit only light having a predetermined wavelength. In addition, ablack resist, Al, or the like can be used as the material of the lightshielding film 22. The black resist is particularly effective as thematerial of the light shielding film 22 from the viewpoint ofsuppressing the return of the 0th-order light L0 incident on the0th-order light capturing portion 34 to the space S. As an example, thelight shielding film 22 may be a composite film including an Al layercovering the surface 21 a of the light transmitting member 21 and ablack resist layer provided in the region of the AL layer that faces atleast the 0th-order light capturing portion 34. In other words, in thecomposite film, the Al layer and the black resist layer are laminated inthis order on the space S side of the light transmitting member 21.

The cover 20 is disposed in the second widened portion 13 b of the sidewall portion 13. A sealing member 4 made of resin, solder, or the likeis disposed between the cover 20 and the second widened portion 13 b. Inthe spectroscope 1, the space S is airtightly sealed and the cover 20and the side wall portion 13 are fixed to each other by the sealingmember 4.

As illustrated in FIGS. 1 and 6, the wiring unit 200 has a supportsubstrate 201, a plurality of terminals (second terminals) 202, aplurality of terminals (third terminals) 203, and a plurality of wirings204. The support substrate 201 is a flexible substrate, formed in a filmshape, and formed of an insulating resin or the like. In the presentembodiment, the bending strength of the support substrate 201 is smallerthan the bending strength of the support body 10. The plurality ofterminals 202, the plurality of terminals 203, and the plurality ofwirings 204 are provided on the support substrate 201.

The support substrate 201 has a first part 211, a second part 212, and athird part 213. The plurality of terminals 202 are provided at the firstpart 211. The plurality of terminals 203 are provided at the second part212. The third part 213 is positioned between the first part 211 and thesecond part 212. The width of the first part 211 in the width directionperpendicular to the length direction in which the first part 211 andthe second part 212 are arranged (X-axis direction in the presentembodiment) is larger than the width of the second part 212 in the widthdirection. The width of the third part 213 in the width directionchanges from the width of the second part 212 to the width of the firstpart 211. In other words, the width of the third part 213 in the widthdirection increases toward the first part 211. The length of the firstpart 211 in the length direction in which the first part 211 and thesecond part 212 are arranged (Z-axis direction in the presentembodiment) is larger than the length of the second part 212 in thelength direction.

As illustrated in FIG. 7, the plurality of terminals 202 are disposed ona surface 201 a on the support body 10 side of the support substrate 201so as to respectively face the plurality of terminals 11 b provided onthe surface of the support body 10. Each terminal 202 is a circularelectrode pad. The terminal 11 b and the terminal 202 facing each otherare joined to each other via a joining member 205. In the presentembodiment, the joining member 205 is a solder layer. The joining member205 holds the gap (such as a gap of approximately 100 μm) that is formedbetween the support body 10 and the wiring unit 200 (specifically,between the outside surface 18 b of the one second side wall 18 and thesurface 201 a of the support substrate 201). The gap is a space whereresin or the like is not disposed.

As illustrated in FIGS. 1 and 6, the plurality of terminals 203 areconfigured as a connector 206. In the present embodiment, the connector206 is disposed on the side opposite to the incident side of the lightL1 in the Z-axis direction with respect to the outside surface 18 b ofthe one second side wall 18. The plurality of wirings 204 extend overthe first part 211, the second part 212, and the third part 213 so as torespectively connect the plurality of terminals 202 and the plurality ofterminals 203 to each other. In other words, the plurality of terminals203 are electrically connected to the plurality of terminals 202,respectively. It should be noted that the part of connection to theconnection destination decreases in size as the width of the second part212 decreases and the extra space can be reduced as a result. In orderto realize such a configuration, it is preferable that the width of eachwiring 204 (width in the X-axis direction) is larger than the distancebetween the wirings 204 adjacent to each other (distance in the X-axisdirection) at least at the second part 212. In addition, at the thirdpart 213, it is preferable that the total value of the widths of theplurality of wirings 204 (widths in the X-axis direction) is 60% or moreof the maximum width of the third part 213 (maximum width in the X-axisdirection). In addition, although the number of the wirings 204 is eightin the example illustrated in FIG. 6, the number of the wirings 204 maybe a plural number (two or more) and may be nine or more. However, thenumber of the wirings 204 is preferably 10 or less considering sizereduction, durability, and so on.

The spectroscope 1 is disposed along the outer edge of the first part211 on the side opposite to the second part 212. When viewed from theY-axis direction, the first part 211 includes the spectroscope 1 andextends so as to project (protrude) from the spectroscope 1 to thesecond part 212 side. The connector 206 is disposed along the outer edgeof the second part 212 on the side opposite to the first part 211. Whenviewed from the Y-axis direction, the second part 212 includes theconnector 206 and extends so as to project (protrude) from the connector206 to the first part 211 side.

It should be noted that the first part 211 overlaps at least the space Sof the spectroscope 1 and the plurality of terminals 11 b and theplurality of terminals 202 are joined to each other in the region wherethe first part 211 and the spectroscope 1 overlap in the spectroscopicmodule 100 when viewed from the Y-axis direction. In the presentembodiment, the plurality of terminals 11 b are disposed so as tosurround the space S when viewed from the Y-axis direction and a part ofeach terminal 11 b overlaps the bottom wall portion 12, the pair offirst side walls 17, and the photodetector 30 when viewed from theY-axis direction. In addition, in the spectroscopic module 100, thefirst part 211 does not project (protrude) to the side other than thesecond part 212 side with respect to the spectroscope 1 when viewed fromthe Y-axis direction.

In the present embodiment, the wiring unit 200 is configured by aflexible wiring substrate. In other words, the wiring unit 200 can berepeatedly deformed (bent or twisted) and has a property of maintainingits electrical characteristics even when deformed. In the spectroscopicmodule 100, an electric signal is input and output with respect to thelight detecting portion 33 of the photodetector 30 via the wiring unit200 and the plurality of wirings 11 by the connector 206 of the wiringunit 200 being connected to, for example, an external rigid wiringsubstrate.

Method for Manufacturing Spectroscopic Module

The spectroscope 1 described above is prepared (first step). Meanwhile,the wiring unit 200 described above is prepared as illustrated in FIG. 8and the joining member 205 is provided at each terminal 202, by heattreatment such as solder paste printing and temporary solder ballfixing, as illustrated in FIG. 9 (second step). In the presentembodiment, a plurality of the wiring units 200 that are connected toeach other are prepared. The plurality of wiring units 200 are connectedto each other via a frame portion 207 formed integrally with the supportsubstrate 201. It should be noted that the order of implementation ofthe first step and the second step is not particularly limited.

Subsequently, the spectroscope 1 is placed on each wiring unit 200 suchthat the terminal 11 b and the terminal 202 facing each other face eachother via the joining member 205 (see FIG. 7) (that is, the plurality ofterminals 11 b and the plurality of terminals 202 are caused to faceeach other) and, as illustrated in FIG. 10, the terminal 11 b and theterminal 202 facing each other are joined to each other via the joiningmember 205 by reflow (that is, heat treatment) (third step). At thistime, since the spectroscope 1 is small in size and weight, thespectroscope 1 is self-aligned with respect to the wiring unit 200, suchthat the terminal 11 b and the terminal 202 facing each other match eachother, by the tension of the molten joining member 205. Subsequently, asillustrated in FIG. 11, the plurality of wiring units 200 to which thespectroscope 1 is attached are separated from each other by being cutout from the frame portion 207.

Subsequently, the relationship between the position (coordinates) ofeach photodetection channel 33 a and the peak wavelength of the light L2incident on each photodetection channel 33 a (hereinafter, sometimessimply referred to as “relationship between the photodetection channel33 a and the peak wavelength”) is acquired in each spectroscopic module100 (fourth step). Specifically, light having a known peak wavelength isincident on the spectroscopic module 100 and the position of thephotodetection channel 33 a at which the detected value peaks isacquired. This is performed with regard to a plurality of known peakwavelengths and an approximate expression (such as a fifth-orderpolynomial) indicating the relationship between the photodetectionchannel 33 a and the peak wavelength is acquired. The acquiredapproximate expression is used when spectroscopic analysis is performedby means of the spectroscopic module 100.

ACTIONS AND EFFECTS

In the spectroscopic module 100, the plurality of terminals 11 belectrically connected to the photodetector 30 are provided on thesurface of the support body 10 and the plurality of terminals 202 of thewiring unit 200 respectively face the plurality of terminals 11 b andare respectively joined to the plurality of terminals 11 b. In aconfiguration in which a plurality of terminals of a rigid wiringsubstrate are respectively joined to the plurality of terminals 11 b,for example, the support body 10 is distorted due to the stress or thelike that is generated during the joining or the support body 10 isdistorted due to the thermal strain or the like that is generated on therigid wiring substrate after the joining, and thus the positionalrelationship between the spectroscopic portion 52 and the photodetector30 may deviate and the relationship between the photodetection channel33 a and the peak wavelength may deviate. In contrast, in thespectroscopic module 100, the electrical connection between thephotodetector 30 and the rigid wiring substrate can be realized via thewiring unit 200, and thus it is possible to suppress the deviation inthe relationship between the photodetection channel 33 a and the peakwavelength. Accordingly, with the spectroscopic module 100, it ispossible to reliably suppress a decline in detection accuracy in theconfiguration in which the spectroscopic portion 52 and thephotodetector 30 face each other via the space S.

It should be noted that the support body 10 in the spectroscopic module100 has the bottom wall portion 12 provided with the spectroscopicportion 52 and the side wall portion 13 to which the photodetector 30 isattached such that the spectroscopic portion 52 and the photodetector 30face each other via the space S. As a result, the spectroscopic portion52 and the photodetector 30 can be stably supported and it is possibleto easily form the space S that includes an optical path reaching thespectroscopic portion 52 from the outside and an optical path reachingthe photodetector 30 from the spectroscopic portion 52. In aconfiguration in which the optical path reaching the spectroscopicportion 52 from the outside and the optical path reaching thephotodetector 30 from the spectroscopic portion 52 are formed in thespace S as described above, the relationship between the photodetectionchannel 33 a and the peak wavelength is likely to deviate, and thus theconfiguration of the spectroscopic module 100 described above isparticularly effective. In addition, the relationship between thephotodetection channel 33 a and the peak wavelength is likely to deviatealso in a configuration in which the support body 10 defining the spaceS is formed of resin, and thus the configuration of the spectroscopicmodule 100 described above is particularly effective.

In addition, in the spectroscopic module 100, the plurality of terminals11 b are provided on the flat region (outside surface 18 b of the onesecond side wall 18 in the present embodiment) that has the largest areaamong the plurality of flat regions constituting the surface of thesupport body 10. As a result, it is possible to improve the degree offreedom in terms of the shape of each terminal 11 b, the disposition ofthe plurality of terminals 11 b, and so on and it is possible to realizea reliable joining between the terminal 11 b and the terminal 202 facingeach other.

In addition, in the spectroscopic module 100, the plurality of terminals11 b are provided on the surface of the side wall portion 13 on the sideopposite to the space S that is the surface of the support body 10(outside surface 18 b of the one second side wall 18 in the presentembodiment). By the surface of the side wall portion 13 on the sideopposite to the space S being wide, it is possible to improve the degreeof freedom in terms of the shape of each terminal 11 b, the dispositionof the plurality of terminals 11 b, and so on and it is possible torealize a reliable joining between the terminal 11 b and the terminal202 facing each other.

In addition, in the spectroscopic module 100, the plurality of terminals11 b are provided on the region of the surface of the side wall portion13 that extends in the X-axis direction, in which the plurality ofgrating grooves 52 a are arranged, as a longitudinal direction (outsidesurface 18 b of the one second side wall 18 in the present embodiment).By the region that extends in the X-axis direction as a longitudinaldirection being wide, it is possible to improve the degree of freedom interms of the shape of each terminal 11 b, the disposition of theplurality of terminals 11 b, and so on and it is possible to realize areliable joining between the terminal 11 b and the terminal 202 facingeach other.

In addition, in the spectroscopic module 100, the terminal 11 b and theterminal 202 facing each other are joined to each other via the joiningmember 205 in the plurality of terminals 11 b and the plurality ofterminals 202. As a result, it is possible to realize a reliable joiningbetween the terminal 11 b and the terminal 202 facing each other.

In addition, in the spectroscopic module 100, the joining member 205 isa solder layer. As a result, it is possible to easily realize a reliablejoining between the terminal 11 b and the terminal 202 facing eachother.

In addition, in the spectroscopic module 100, the joining member 205holds the gap that is formed between the support body 10 and the wiringunit 200. As a result, even if the wiring unit 200 is deformed, theimpact of the deformation is mitigated in the gap between the supportbody 10 and the wiring unit 200, and thus it is possible to suppress adeviation in the relationship between the photodetection channel 33 aand the peak wavelength attributable to the deformation of the supportbody 10. The wiring unit 200 is easily deformed when a flexible wiringsubstrate constitutes the wiring unit 200 or the support substrate 201of the wiring unit 200 is smaller in bending strength than the supportbody 10 in particular. Accordingly, the configuration in which the gapas a space is formed between the support body 10 and the wiring unit 200is extremely effective as a configuration capable of mitigating theimpact of the wiring unit 200.

In addition, in the spectroscopic module 100, each of the plurality ofterminals 11 b is a circular electrode pad. As a result, even if thewiring unit 200 is deformed, the stress concentration that isattributable to the deformation is mitigated at each terminal 11 b, andthus it is possible to suppress a deviation in the relationship betweenthe photodetection channel 33 a and the peak wavelength attributable tothe deformation of the support body 10. Further, the impact of thestress that is generated during the joining between the terminal 11 band the terminal 202 facing each other is also mitigated at eachterminal 11 b, and thus it is possible to suppress a deviation in therelationship between the photodetection channel 33 a and the peakwavelength attributable to the impact of the stress generated during thejoining.

In addition, in the spectroscopic module 100, each of the plurality ofterminals 202 is a circular electrode pad. As a result, even if thewiring unit 200 is deformed, the stress concentration that isattributable to the deformation is mitigated at each terminal 202, andthus it is possible to suppress a deviation in the relationship betweenthe photodetection channel 33 a and the peak wavelength attributable tothe deformation of the support body 10. Further, the impact of thestress that is generated during the joining between the terminal 11 band the terminal 202 facing each other is also mitigated at eachterminal 202, and thus it is possible to suppress a deviation in therelationship between the photodetection channel 33 a and the peakwavelength attributable to the impact of the stress generated during thejoining.

In addition, in the spectroscopic module 100, the plurality of terminals203 are configured as the connector. As a result, the support body 10 isnot thermally affected when, for example, the wiring unit 200 isconnected to a rigid wiring substrate, and thus it is possible tosuppress a deviation in the relationship between the photodetectionchannel 33 a and the peak wavelength.

In addition, in the spectroscopic module 100, the wiring unit 200 isconfigured by a flexible wiring substrate. As a result, even if thewiring unit 200 is deformed, the stress concentration that isattributable to the deformation is unlikely to occur in the support body10, and thus it is possible to suppress a deviation in the relationshipbetween the photodetection channel 33 a and the peak wavelengthattributable to the deformation of the support body 10. In addition, thedifference in thermal expansion coefficient between the wiring unit 200and the support body 10 is absorbed by the flexibility of the wiringunit 200, and thus it is possible to suppress a deviation in therelationship between the photodetection channel 33 a and the peakwavelength even if the temperature of the environment of use changes. Inaddition, stress is absorbed by the flexibility of the wiring unit 200,and thus it is possible to stabilize the joining between the terminal 11b and the terminal 202 facing each other and it is possible to reducethe residual stress that is generated during the joining between theterminal 11 b and the terminal 202 facing each other. Further, thespectroscope 1 can be installed in a desired direction.

It should be noted that high accuracy is required with regard to theorientation and position of the spectroscope 1 with respect to aninstallation target in the spectroscope 1 in which one side is as shortas 15 mm or less as described above (particularly in the spectroscope 1in which the length in the Y-axis direction is as small as approximatelyseveral millimeters). In addition, when the installation target isdeformed, the relationship between the photodetection channel 33 a andthe peak wavelength may deviate due to the deformation. When theelectrode pad provided on the surface of the support body 10 is joinedto the electrode pad of the wiring substrate in such a situation withregard to the spectroscope 1 described above, a rigid wiring substratethat is unlikely to deform has been selected as a wiring substrate and aflexible wiring substrate that is likely to deform has not beenselected. In the spectroscopic module 100, it is possible to realize thehigh accuracy required with regard to the orientation and position ofthe spectroscope 1 with respect to the installation target andsuppression of the deviation in the relationship between thephotodetection channel 33 a and the peak wavelength by deliberatelyadopting the wiring unit 200 configured by a flexible wiring substrate.

In addition, in the spectroscopic module 100, the bending strength ofthe support substrate 201 of the wiring unit 200 is smaller than thebending strength of the support body 10. As a result, even if the wiringunit 200 is deformed, the stress concentration that is attributable tothe deformation is unlikely to occur in the support body 10, and thus itis possible to suppress a deviation in the relationship between thephotodetection channel 33 a and the peak wavelength attributable to thedeformation of the support body 10. In addition, the difference inthermal expansion coefficient between the wiring unit 200 and thesupport body 10 is absorbed by the flexibility of the wiring unit 200,and thus it is possible to suppress a deviation in the relationshipbetween the photodetection channel 33 a and the peak wavelength even ifthe temperature of the environment of use changes. In addition, stressis absorbed by the flexibility of the wiring unit 200, and thus it ispossible to stabilize the joining between the terminal 11 b and theterminal 202 facing each other and it is possible to reduce the residualstress that is generated during the joining between the terminal 11 band the terminal 202 facing each other.

In addition, in the spectroscopic module 100, the support substrate 201of the wiring unit 200 has the first part 211 provided with theplurality of terminals 202, the second part 212 provided with theplurality of terminals 203, and the third part 213 positioned betweenthe first part 211 and the second part 212 and the width of the thirdpart 213 in the width direction perpendicular to the length direction inwhich the first part 211 and the second part 212 are arranged increasestoward the first part 211. As a result, even if an external force isapplied to the second part 212, the external force is absorbed by thethird part 213, and thus it is possible to suppress the external forcehaving an impact on the support body 10 of the spectroscope 1. Inaddition, stress concentration at the connector 206 is also suppressedby the support substrate 201 of the wiring unit 200 being provided withthe third part 213. Further, the length of the second part 212 in thelength direction in which the first part 211 and the second part 212 arearranged is smaller than the length of the first part 211 in the lengthdirection, and thus the handling of the spectroscopic module 100 bymeans of the support substrate 201 of the wiring unit 200 isfacilitated. It should be noted that the handling of the spectroscopicmodule 100 by means of the support substrate 201 of the wiring unit 200is facilitated when the length of the second part 212 in the lengthdirection in which the first part 211 and the second part 212 arearranged is smaller than the sum of the length of the first part 211 inthe length direction and the length of the third part 213 in the lengthdirection.

It should be noted that the support substrate 201 of the wiring unit 200being grippable in the handling of the spectroscopic module 100 isextremely effective, regardless of whether or not the support substrate201 of the wiring unit 200 is provided with the third part 213, when thespectroscope 1 is reduced in size to the extent that the length of oneside is 15 mm or less as described above. When the support substrate 201of the wiring unit 200 is provided with the third part 213 inparticular, it is possible to handle the spectroscopic module 100without touching the wiring 204 of the wiring unit 200 and thespectroscope 1.

In addition, in the spectroscopic module 100, the first part 211overlaps at least the space S of the spectroscope 1 and the plurality ofterminals 11 b and the plurality of terminals 202 are joined to eachother in the region where the first part 211 and the spectroscope 1overlap when viewed from the Y-axis direction. As a result, when thesupport substrate 201 of the wiring unit 200 is gripped in the handlingof the spectroscopic module 100, the wiring unit 200 being inadvertentlybent due to the weight of the spectroscope 1 is suppressed and thehandleability of the spectroscopic module 100 is improved. Further, inthe present embodiment, the plurality of terminals 11 b are disposed soas to surround the space S when viewed from the Y-axis direction and atleast a part of each terminal 11 b overlaps the bottom wall portion 12,the pair of first side walls 17, and the photodetector 30 when viewedfrom the Y-axis direction. As a result, it is possible to suppress thedistortion of the support body 10 that is attributable to the stressgenerated during and after the joining between the terminal 11 b and theterminal 202 facing each other.

In addition, in the spectroscopic module 100, the first part 211 doesnot project (protrude) to the side other than the second part 212 sidewith respect to the spectroscope 1 when viewed from the Y-axisdirection. If the first part 211 significantly projects to the sideother than the second part 212 side with respect to the spectroscope 1,the projecting part may, for example, come into contact with any memberto result in extra load application to the spectroscopic module 100 or adecline in the handleability of the spectroscopic module 100. Incontrast, in the spectroscopic module 100, the first part 211 does notproject to the side other than the second part 212 side with respect tothe spectroscope 1, and thus such a situation is suppressed. It shouldbe noted that the situation described above is sufficiently suppressed,even if the first part 211 projects to the side other than the secondpart 212 side with respect to the spectroscope 1 when viewed from theY-axis direction, if the area of the projecting region is smaller thanthe area of the region where the first part 211 and the spectroscope 1overlap when viewed from the Y-axis direction.

In addition, the following actions and effects are derived from themethod for manufacturing the spectroscopic module 100. If the terminal11 b and the terminal 202 facing each other are joined to each otherafter, for example, the acquisition of the relationship between thephotodetection channel 33 a and the peak wavelength, the support body 10is distorted due to the stress or the like that is generated during thejoining and the acquired relationship may deviate. In contrast, in themethod for manufacturing the spectroscopic module 100, the relationshipbetween the photodetection channel 33 a and the peak wavelength isacquired after the terminal 11 b and the terminal 202 facing each otherare joined to each other. Therefore, according to the method formanufacturing the spectroscopic module 100, it is possible to reliablysuppress a decline in detection accuracy in the manufacturedspectroscopic module 100 by performing spectroscopic analysis based onthe acquired relationship.

In addition, if the joining member 205 is provided for each of theplurality of terminals 11 b by heat treatment and the terminal 11 b andthe terminal 202 facing each other are joined to each other via thejoining member 205 by heat treatment, for example, the support body 10is thermally affected twice, and thus the deviation that occurs in therelationship between the photodetection channel 33 a and the peakwavelength may increase. In contrast, in the method for manufacturingthe spectroscopic module 100, the joining member 205 is provided foreach of the plurality of terminals 202 by heat treatment and theterminal 11 b and the terminal 202 facing each other are joined to eachother via the joining member 205 by heat treatment, and thus the supportbody 10 is thermally affected only once. Therefore, according to themethod for manufacturing the spectroscopic module 100, it is possible tosuppress a deviation in the relationship between the photodetectionchannel 33 a and the peak wavelength and reliably suppress a decline indetection accuracy in the manufactured spectroscopic module 100.

In addition, in the method for manufacturing the spectroscopic module100, the plurality of wiring units 200 connected to each other areprepared and the plurality of wiring units 200 to which the spectroscope1 is attached are separated from each other after the terminal 11 b andthe terminal 202 facing each other are joined to each other. As aresult, a plurality of the spectroscopic modules 100 can be efficientlymanufactured.

MODIFICATION EXAMPLES

The present disclosure is not limited to the embodiment described above.For example, as illustrated in (a) of FIG. 12, the wiring unit 200 maybe provided with an attachment portion 208 for installing thespectroscope 1. In the wiring unit 200 illustrated in (a) of FIG. 12, apair of the attachment portions 208 are provided on both sides in theX-axis direction with respect to the outside surface 18 b of the onesecond side wall 18. The pair of attachment portions 208 are formedintegrally with the support substrate 201, and each attachment portion208 is provided with a hole 208 a through which a bolt for installingthe spectroscope 1 is passed. In addition, as illustrated in (b) of FIG.12, the connector 206 in the wiring unit 200 may be disposed on one sidein the X-axis direction with respect to the outside surface 18 b of theone second side wall 18. In other words, the positions of the pluralityof terminals 203 with respect to the spectroscope 1 are not limited tothose described above. The wiring unit 200 illustrated in (a) and (b) ofFIG. 12 also has the first part 211, the second part 212, and the thirdpart 213 as in the case of the wiring unit 200 illustrated in FIG. 1,and thus the external force applied to the second part 212 having animpact on the support body 10 of the spectroscope 1 is suppressed,stress concentration at the connector 206 is suppressed, and thehandling of the spectroscopic module 100 by means of the supportsubstrate 201 of the wiring unit 200 is facilitated as in the case ofthe wiring unit 200 illustrated in FIG. 1.

In addition, by conditions such as the load on the joining member 205being changed during the joining, for example, the side surface of thejoining member 205 becomes a convex curved surface or the gap betweenthe support body 10 and the wiring unit 200 becomes large as illustratedin (a) of FIG. 13. When the side surface of the joining member 205 is aconvex curved surface, the stress generated during and after the joiningbetween the terminal 11 b and the terminal 202 facing each other ismitigated in the joining member 205 and the distortion of the supportbody 10 is suppressed. It should be noted that a force for pressing thespectroscope 1 to the wiring unit 200 side may be applied during thejoining between the terminal 11 b and the terminal 202 facing eachother. For example, it is possible to adjust the shape of the sidesurface of the joining member 205, the size of the gap between thesupport body 10 and the wiring unit 200, and so on by adjusting themagnitude of the force. In addition, as illustrated in (b) of FIG. 13,the terminal 11 b and the terminal 202 facing each other may be joinedto each other via the joining member 205 made of a solder ball with acore. In that case, it is possible to adjust the size of the gap betweenthe support body 10 and the wiring unit 200 by adjusting the size of thecore. It should be noted that a metal core made of copper or the like, aresin core, or the like is used as the core of the solder ball with acore.

In addition, the support substrate 201 may have the first part 211 andthe second part 212 without having the third part 213. In that case, thesecond part 212 is, for example, directly connected to the first part211. In addition, the plurality of terminals 203 and the plurality ofwirings 204 may be disposed on the back surface of the support substrate201 (surface on the side opposite to the surface 201 a). In addition,only the plurality of terminals 203 may be disposed on the back surfaceof the support substrate 201 (surface on the side opposite to thesurface 201 a). Although it is preferable that the wiring 204 is shortin length, the length of the wiring 204 may have to be increased, due toa reason related to the layout of the spectroscope 1 or the like, in aconfiguration in which the plurality of terminals 203 are disposed onthe surface 201 a of the support substrate 201. In contrast, in theconfiguration in which the plurality of terminals 203 are disposed onthe back surface of the support substrate 201 (surface on the sideopposite to the surface 201 a), it may be possible to realize a desiredlayout while reducing the length of the wiring 204. In addition, thewidth of the first part 211 in the direction in which each wiring 204extends (Z-axis direction in the embodiment described above) may beequal to or less than the width of the spectroscope 1 in the samedirection. Even in that case, the second part 212 may be directlyconnected to the first part 211 with the support substrate 201 lackingthe third part 213. In addition, the second part 212 may have a flatplate shape as in the embodiment described above or may have a curvedshape.

In addition, as illustrated in FIG. 14, a side surface 13 a ₂ of thefirst widened portion 13 a may be inclined so as to form an obtuse anglewith a bottom surface 13 a ₁ of the first widened portion 13 a in thefirst widened portion 13 a where the photodetector 30 is disposed. Inaddition, in the second widened portion 13 b where the cover 20 isdisposed, a side surface 13 b ₂ of the second widened portion 13 b maybe inclined so as to form an obtuse angle with a bottom surface 13 b ₁of the second widened portion 13 b. In this manner, the wiring 11 can berouted with ease and accuracy. In addition, the stress that is generatedin the wiring 11 can be reduced.

In addition, the space between the side surface 13 a ₂ of the firstwidened portion 13 a and the photodetector 30 may be filled with thereinforcing member 7 that is made of resin. In this manner, thereinforcing member 7 easily enters the gap by the side surface 13 a ₂being inclined, and thus it is possible to more sufficiently reinforcethe support of the photodetector 30 and more sufficiently ensure theairtightness at the part. In addition, it is possible to more reliablysuppress the misalignment of the photodetector 30 in the X-axisdirection (second direction in which the plurality of grating grooves 52a of the spectroscopic portion 52 are arranged) by means of thesynergistic effect in relation to the disposition of a bump 61 to bedescribed later. In addition, the space between the side surface 13 b ₂of the second widened portion 13 b and the cover 20 may be filled withthe sealing member 4 that is made of resin. In this manner, the sealingmember 4 easily enters the gap by the side surface 13 b ₂ beinginclined, and thus it is possible to more sufficiently reinforce thesupport of the cover 20 and more sufficiently ensure the airtightness atthe part. It should be noted that the airtightness may be ensured by thespace between the side surface 13 a ₂ of the first widened portion 13 aand the photodetector 30 being filled with the resinous reinforcingmember 7, by the space between the side surface 13 b ₂ of the secondwidened portion 13 b and the cover 20 being filled with the resinoussealing member 4, or by both. The airtightness may also be ensured by aconfiguration other than these airtightness-related configurations (suchas accommodating the spectroscope 1 in another package and making theinside of the package airtight).

In addition, as illustrated in FIG. 14, at least a region 10 a ₁, wherethe wiring 11 is disposed, of an end surface 10 a of the support body 10on the side opposite to the bottom wall portion 12 may be positionedcloser to the bottom wall portion 12 side than a surface 20 a of thecover 20 on the side opposite to the bottom wall portion 12. In thismanner, it is possible to prevent the wiring 11 from coming into contactwith another member when the spectroscope 1 is mounted. In addition, thelength of the wiring 11 can be reduced. It should be noted that theentire end surface 10 a of the support body 10 may be positioned closerto the bottom wall portion 12 side than the surface 20 a of the cover20.

In addition, as illustrated in FIG. 14, the cover 20 and thephotodetector 30 may be separated from each other. In this manner, thespace between the cover 20 and the photodetector 30 traps stray lightand the stray light can be removed in a more reliable manner.

In addition, the coefficient of thermal expansion of the support body 10in the X-axis direction (second direction in which the plurality ofgrating grooves 52 a of the spectroscopic portion 52 are arranged) isequal to or less than the coefficient of thermal expansion of thesupport body 10 in the Y-axis direction (third direction perpendicularto the second direction and perpendicular to the first direction inwhich the depressed portion 14 and the photodetector 30 face each other)(it is more preferable that the coefficient of thermal expansion of thesupport body 10 in the X-axis direction is smaller than the coefficientof thermal expansion of the support body 10 in the Y-axis direction). Inother words, the relationship of α≤β is satisfied when the coefficientof thermal expansion of the support body 10 in the X-axis direction is αand the coefficient of thermal expansion of the support body 10 in theY-axis direction is β (it is more preferable that the relationship of aα<β is satisfied). In this manner, it is possible to suppress adeviation in the positional relationship between the plurality ofgrating grooves 52 a in the spectroscopic portion 52 and the pluralityof photodetection channels 33 a in the light detecting portion 33 of thephotodetector 30 attributable to the thermal expansion of the supportbody 10.

In addition, as illustrated in FIG. 14, one terminal 36 of thephotodetector 30 and one terminal 11 a of the wiring 11 facing eachother are connected to each other by, for example, a plurality of thebumps 61 made of Au, solder, or the like and the plurality of bumps 61may are arranged along the X-axis direction (second direction in whichthe plurality of grating grooves 52 a of the spectroscopic portion 52are arranged). Further, a plurality of sets of the terminal 36, theterminal 11 a, and the plurality of bumps 61 may be provided in theY-axis direction. In this manner, it is possible to suppress a deviationin the positional relationship between the plurality of grating grooves52 a in the spectroscopic portion 52 and the plurality of photodetectionchannels 33 a in the light detecting portion 33 of the photodetector 30attributable to, for example, the thermal expansion of the support body10. In addition, a sufficient space can be used, as compared with a casewhere the bumps 61 are disposed in one row, by the bumps 61 beingdisposed in a two-dimensional manner, and thus the area of each terminal36 can be sufficiently ensured.

In addition, the first widened portion 13 a may be a stepped portionwhere the space S (space where the optical path of the light L1 from thelight passage portion 31 to the spectroscopic portion 52, the opticalpath of the light L2 from the spectroscopic portion 52 to the lightdetecting portion 33, and the optical path of the 0th-order light L0from the spectroscopic portion 52 to the 0th-order light capturingportion 34 are formed) is widened in at least one direction (such as theX-axis direction) on the side opposite to the bottom wall portion 12 andmay be configured in one stage or in a plurality of stages. Likewise,the second widened portion 13 b may be a stepped portion where the firstwidened portion 13 a is widened in at least one direction (such as theX-axis direction) on the side opposite to the bottom wall portion 12 andmay be configured in one stage or in a plurality of stages. When eachterminal 36 is electrically connected to the terminal 11 a of thecorresponding wiring 11 by wire bonding with the light detecting portion33 configured as a backside-incident photodiode and the plurality ofterminals 36 provided on the surface of the substrate 35 on the sideopposite to the surface 35 a, the terminal 11 a of each wiring 11 may bedisposed in a stage different from the stage where the photodetector 30is disposed (stage outside and above the stage where the photodetector30 is disposed) in the multistage first widened portion 13 a.

In addition, the support body 10 is not limited to a resinous supportbody and may be formed of ceramic such as AlN and Al₂O₃ or glass formolding. In addition, the shape of the support body 10 is not limited toa rectangular parallelepiped shape and may be, for example, a shape inwhich the outside surface is provided with a curved surface. Inaddition, the shape of the side wall portion 13 is not limited to arectangular ring shape and may be a circular ring shape insofar as theshape is an annular shape surrounding the depressed portion 14 whenviewed from the Z-axis direction.

In addition, the photodetector 30 may lack the light passage portion 31,the second reflection portion 32, and the 0th-order light capturingportion 34 insofar as the photodetector 30 has the light detectingportion 33. In addition, the photodetector 30 may be attached to theside wall portion 13 via a member separate from the side wall portion13. In addition, the spectroscopic portion 52 may be configured as aspectroscopic element and attached to the support body 10.

In addition, the plurality of terminals 11 b may be provided on a regionother than the outside surface 18 b of the one second side wall 18insofar as the region is the surface of the support body 10. It shouldbe noted that “terminal” is a general term for a part to be connected toanother member, may not be a wiring end portion, and may not be widerthan the wiring. In other words, the position and shape of the terminal11 b are not limited to those illustrated in FIG. 2. In addition,although the plurality of terminals 11 b are disposed so as to surroundthe space S when viewed from the Y-axis direction and a part of eachterminal 11 b overlaps the bottom wall portion 12, the pair of firstside walls 17, and the photodetector 30 when viewed from the Y-axisdirection in the embodiment described above, the position of theterminal 11 b is not limited thereto. For example, with regard to atleast a part of the plurality of terminals 11 b, the entire part of theterminal 11 b may overlap the bottom wall portion 12, the pair of firstside walls 17, and the photodetector 30 when viewed from the Y-axisdirection or the entire part of the terminal 11 b may overlap the spaceS when viewed from the Y-axis direction. In addition, the terminal 11 band the terminal 202 facing each other may be joined to each other via ajoining member (such as a conductive adhesive allowing room-temperaturejoining) other than the joining member 205 (such as solder paste, asolder ball, and a solder ball with a core) capable of joining theterminal 11 b and the terminal 202 by heat treatment.

In addition, the spectroscope 1 may lack the first reflection portion 51and the second reflection portion 32, the light L1 that has passedthrough the light passage portion 31 may be dispersed and reflected bythe spectroscopic portion 52, and the light L2 dispersed and reflectedby the spectroscopic portion 52 may be incident on the light detectingportion 33 and detected by the light detecting portion 33. In addition,in the spectroscope 1, the space S may not be airtightly sealed by, forexample, a gap being provided in part between the cover 20 and the sidewall portion 13.

In addition, as illustrated in FIG. 15, the spectroscopic module 100 mayfurther include a rigid wiring substrate 300 to which the plurality ofterminals 203 of the wiring unit 200 are connected. In that case, it ispossible to realize an electrical connection between the photodetector30 and the rigid wiring substrate 300 while reliably suppressing adecline in detection accuracy in a configuration in which thespectroscopic portion 52 and the photodetector 30 face each other viathe space S.

In addition, various materials and shapes can be applied to eachconfiguration of the spectroscopic module 100 without being limited tothe above-described material and shape examples. In addition, eachconfiguration in the embodiment or one of the modification examplesdescribed above can be applied in any manner to each configuration inanother embodiment or modification example.

REFERENCE SIGNS LIST

1: spectroscope, 10: support body, 11 b: terminal (first terminal), 12:bottom wall portion, 13: side wall portion, 18 b: outside surface(surface), 30: photodetector, 33 a: photodetection channel, 52:spectroscopic portion, 52 a: grating groove, 100: spectroscopic module,200: wiring unit, 201: support substrate, 202: terminal (secondterminal), 203: terminal (third terminal), 204: wiring, 205: joiningmember, 300: rigid wiring substrate, S: space.

1-13. (canceled)
 14. A method for manufacturing spectroscopic module,the method comprising: a first step of preparing a spectroscopeincluding a support body having a bottom wall portion and a side wallportion surrounding a space on one side of the bottom wall portion, aspectroscopic portion provided on the one side of the bottom wallportion and having a plurality of grating grooves, a photodetectorattached to the side wall portion so as to face the spectroscopicportion via the space and having a plurality of photodetection channels,and a plurality of first terminals provided on a surface of the supportbody so as to be disposed along the surface of the support body andelectrically connected to the photodetector; a second step of preparinga wiring unit having a plurality of second terminals and a plurality ofthird terminals respectively and electrically connected to the pluralityof second terminals; a third step of causing the plurality of firstterminals and the plurality of second terminals to face each other andjoining a first terminal and a second terminal to each other after thefirst step and the second step, the first terminal and the secondterminal facing each other in the plurality of first terminals and theplurality of second terminals; and a fourth step of acquiring arelationship between a position of each of the plurality ofphotodetection channels and a peak wavelength of light incident on eachof the plurality of photodetection channels after the third step. 15.(canceled)
 16. (canceled)
 17. The method for manufacturing spectroscopicmodule according to claim 14, wherein the plurality of first terminalsare provided on a flat region having a largest area among_a plurality offlat regions, the plurality of flat regions constituting the surface ofthe support body.
 18. The method for manufacturing spectroscopic moduleaccording to claim 14, wherein the plurality of first terminals areprovided on a surface of the side wall portion on the side opposite tothe space as the surface of the support body.
 19. The method formanufacturing spectroscopic module according to claim 18, wherein thespectroscopic portion and the photodetector face each other in a firstdirection, the plurality of grating grooves are arranged in a seconddirection perpendicular to the first direction, and the plurality offirst terminals are provided on a region of the surface of the side wallportion, the region extending in the second direction as a longitudinaldirection.
 20. The method for manufacturing spectroscopic moduleaccording to claim 14, wherein a first terminal and a second terminalfacing each other in the plurality of first terminals and the pluralityof second terminals are joined to each other via a joining member. 21.The method for manufacturing spectroscopic module according to claim 20,wherein the joining member is a solder layer.
 22. The method formanufacturing spectroscopic module according to claim 20, wherein thejoining member holds a gap formed between the support body and thewiring unit.
 23. The method for manufacturing spectroscopic moduleaccording to claim 14, wherein each of the plurality of first terminalsis a circular electrode pad.
 24. The method for manufacturingspectroscopic module according to claim 14, wherein each of theplurality of second terminals is a circular electrode pad.
 25. Themethod for manufacturing spectroscopic module according to claim 14,wherein the plurality of third terminals are configured as a connector.26. The method for manufacturing spectroscopic module according to claim14, wherein the wiring unit is configured by a flexible wiringsubstrate.
 27. The method for manufacturing spectroscopic moduleaccording to claim 14, wherein the wiring unit further has a pluralityof wirings respectively connecting the plurality of second terminals andthe plurality of third terminals, and a support substrate, and a bendingstrength of the support substrate is smaller than a bending strength ofthe support body.
 28. The method for manufacturing spectroscopic moduleaccording to claim 14, further comprising a rigid wiring substrate towhich the plurality of third terminals are connected.